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Highly thermally-conductive bonding and printed materials
May 21, 2012
By: DAVID SAVASTANO
Editor, Ink World Magazine
Applied Nanotech Holdings, Inc. announced that it has unveiled a new family of highly thermally-conductive bonding and printed materials called ThercoBond for power electronics and photonics applications. ThercoBond materials are specially designed for power electronic device packaging and dielectric coating, with an optimal combination of thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties, wettability and printability. “The implementation of...
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